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Performance of Thin Film Silicon MEMS on Flexible Plastic Substrates

Published online by Cambridge University Press:  01 February 2011

Samadhan Patil ,
Virginia Chu  and
Joao Pedro Conde
Samadhan Patil
Affiliation:
spatil@inesc-mn.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal, +351-21-3100237, +351-21-3145843
Virginia Chu
Affiliation:
vchu@inesc-mn.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal
Joao Pedro Conde
Affiliation:
joao.conde@ist.utl.pt, INESC MN, n/a, Rua Alves Redol, 9, Lisbon, 1000-029, Portugal
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Abstract

Microresonators based on thin film hydrogenated amorphous silicon microbridges were fabricated by surface micromachining on flexible polyethylene terephthalate (PET) substrates with a maximum processing temperature of 110°C. An aluminum sacrificial layer is used which is patterned by either wet etching or lift-off. Resonance in the MHz range was observed using electrostatic actuation. Processing of the microbridges on PET with sacrificial layer patterned by lift-off has higher yield than by etching. Bending measurements show that the thin film silicon microbridges on PET can withstand a higher compressive strain (-2.5%) than tensile strain (1.25%).

Keywords

microelectro-mechanical (MEMS)thin filmpolymer

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