LCP for system design

doi:10.1017/CBO9780511777240.008

7 - LCP for system design

Published online by Cambridge University Press: 05 July 2012

Morgan J. Chen and

Jia-Chi Samuel Chieh and

Anh-Vu H. Pham

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Anh-Vu H. Pham: Affiliation:
University of California, Davis
Morgan J. Chen: Affiliation:
Huawei Technologies
Kunia Aihara: Affiliation:
Hirose Electric

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Summary

This chapter presents a number of subsystem-level modules that benefit from anLCP implementation. The first module, in section 7.1, is a long time delay (LTD)circuit with amplitude compensation. This module demonstrates the advantages ofhomogenous dielectric core and ply layers in a multilayer build. Known analyticsolutions for transmission lines may be readily applied for first-pass success.In addition, the homogenous multilayer build achieves amplitude compensationthrough novel LCP transmission line implementations. Lastly, this moduledemonstrates LCP’s surface mount (SMT) component compatibility withcommercially available MEMS switches.

The second module, in section 7.2, is a push–pull amplifier. This moduledemonstrates how LCP’s multilayer construction easily allows minimallyshort bondwires for high-performance chip interconnect. Further, this moduleintegrates high-performance LCP baluns to achieve excellent even-mode distortioncancellation. This module also demonstrates how LCP lends itself naturally tothe higher-level integration of LCP-enhanced passives.

Lastly, a receiver module with a built-in phased-array antenna is described insection 7.3 . In this receiver module , LCP is demonstrated to provide aconvenient platform for mechanically flexible electronics. Passive antennastructures are designed directly into the LCP build. Active semiconductor chipsare packaged into this platform to show how LCP is ideally suited for buildingup large systems.

Each module represents advanced research based on an LCP platform that extendsthe electrical performance and mechanical functionality of today’s subsystemmodules.

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Type: Chapter
Information: LCP for Microwave Packages and Modules , pp. 193 - 225

DOI: https://doi.org/10.1017/CBO9780511777240.008 [Opens in a new window]

Publisher: Cambridge University Press

Print publication year: 2012

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