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Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages

Published online by Cambridge University Press:  10 February 2011

Bongtae Han
Bongtae Han*
Affiliation:
Mechanical Engineering Department, Clemson University, Clemson, SC 29634, bhan@ces.clemson.edu
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Abstract

Features and recent developments of various photomechanics methods are reviewed for thermal deformation analyses of electronic packages. Applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and resolution scales, is ideally suited for the deformation study of a broad range of problems in deformation analyses of electronic packaging. The methods are mature and they can be practiced routinely. A more extensive range of applications are anticipated.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 167
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Kobayashi, A. S., ed., “Handbook on Experimental Mechanics,” Prentice-Hall, Englewood Cliffs, NJ, 1987.Google Scholar
2. Post, D., Han, B., Ifju, P., “High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials,” Springer-Verlag, NY, 1994.Google Scholar
3. Guo, Y., Lim, C. K., Chen, W. T., , C. G. and Woychik, , “Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and Its Interpretation,” IBM Journal of Research and Development, Vol.37, No. 5, pp. 635–648, 1993.Google Scholar
4. Han, B. and Guo, Y., “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” Journal of Electronic Packaging, Transaction of ASME, Vol.117, pp. 185–191, 1995.Google Scholar
5. Han, B. and Guo, Y., “Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology-Part A, Vol.19, No. 2, pp. 240–247, 1996.Google Scholar
6. Han, B., “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol.119, pp. 189–196, 1997.Google Scholar
7. Han, B., Guo, Y., Lim, C. K. and Caletka, D., “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,” Journal of Electronic Packaging, Transaction of the ASME, Vol.118, pp. 157–163, 1996.Google Scholar
8. Beckmann, P. and Spizzichino, A., The Scattering of Electromagnetic Wave from Rough Surface, New York: Macmillan, 1963.Google Scholar
9. Munnerlyn, C. R. and Latta, M., “Rough Surface Interferometry Using CO2 Laser Source,” Applied Optics, Vol.7, No. 9, pp. 1858–1859, 1968.Google Scholar
10. Kwon, O., Wyant, J. C. and Hayslett, C. R., “Rough Surface Interferometry at 10.6 μm,” Applied Optics, Vol.19, No. 11, pp. 1862–1869, 1980.Google Scholar
11. Sinha, J. and Tippur, H., “Infrared Interferometry for Rough Surface Measurements: Application to Failure Characterization and Flaw Detection,” Optical Engineering, Vol.38, No. 8, pp. 2233–2239.Google Scholar
12. Verma, K., Columbus, D., Han, B. and Chandran, B., “Real-time Warpage Measurement of Electronic Components with Variable Sensitivity,” Proceedings of 1998 ECTC, Seattle Washington, May 1998.Google Scholar
13. Han, B. and Guo, Y., “Photomechanics Tools as Applied to Electronic Packaging Product Development,” Han, B., Mahajan, R. and Barker, D., ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol.1, pp. 11–15, Society for Experimental Mechanics, Bethel, CT, 1997.Google Scholar