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Vibrating RF MEMS for Low Power Communications

Published online by Cambridge University Press:  11 February 2011

Clark T.-C. Nguyen
Clark T.-C. Nguyen*
Affiliation:
Center for Integrated Wireless Microsystems, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109–2122, U.S.A.
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Abstract

Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumption. Technologies that integrate MEMS and transistor circuits into single-chip systems are then reviewed with an eye towards the possibility of single-chip communication transceivers.

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References

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