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Published online by Cambridge University Press: 17 March 2011
Ion bombardment during thin film growth is known to cause structural andmorphological changes in the deposited films and thus affecting the filmproperties. These effects can be due to the variation in the bombarding ionflux or their energy. We have deposited titanium nitride films by twodistinctly different methods, viz. Electron Cyclotron Resonance (ECR) plasmasputtering and bias assisted reactive magnetron sputtering. The formerrepresents low energy (typically less than 30 eV) but high density plasma (1011cm−3), whereas, in the latter case the ionenergy is controlled by varying the bias to the substrate (typically a fewhundred volts) but the ion flux is low (109cm−3). Thedeposited titanium nitride films are characterized for their structure,grain size, surface roughness and electrical resistivity.