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Si-On-Insulator Formation Using a Line-Source ElectronBeam

Published online by Cambridge University Press:  25 February 2011

J.A. Knapp*
Affiliation:
Sandia National Laboratories, Albuquerque, NM87185, USA
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Abstract

A line-source electron beam has been used to melt and recrystallize isolatedSi layers to form Si-on-Insulator structures, and the processis simulated byheat flow calculations. Using sample sweep speeds of 100-600 cm/s and peakpower densities up to 75 kW/cm2 in the 1 × 20 mm beam, we haveobtained single-crystal areas as large as 50 × 350 μIm. Seed openings to thesubstrate are used to control the orientation of the regrowth and the heatflow in the recrystallizing film. A finite-element heat flow code has beendeveloped which correctly simulates the experimental results and whichallows the calculation of untried sample configurations.

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References

REFERENCES

1. See, for example, the papers in Energy Beam-Solid Interactions and Transient Thermal Processing, Fan, J. C. C., and Johnson, N. M., eds. (North Holland, NY 1984).Google Scholar
2. Knapp, J. A., and Picraux, S. T., Laser-Solid Interactions and Thermal Processing of Materials, Narayan, J., Brown, W. L., and Lemons, R. A., eds. (North Holland, NY 1983), p.557.Google Scholar
3. Knapp, J. A., and Picraux, S. T., the papers in Energy Beam-Solid Interactions and Transient Thermal Processing, Fan, J. C. C., and Johnson, N. M., eds. (North Holland, NY 1984), p.533.Google Scholar
4. Davis, J. R., McMahon, R. A., and Ahmed, H., Laser-Solid Interactions and Thermal Processing of Materials, Narayan, J., Brown, W. L., and Lemons, R. A., eds. (North Holland, NY 1983), p.563.Google Scholar
5. Inoue, T., Shibata, K., Kato, K., Yoshii, T., Higashinakagawa, I., Taniguchi, K., and Kashiwagi, M., the papers in Energy Beam-Solid Interactions and Transient Thermal Processing, Fan, J. C. C., and Johnson, N. M., eds. (North Holland, NY 1984), p. 523.Google Scholar
6. Hayafuji, Y., Yanada, T., Hayashi, H., Williams, K. E., Usui, S., Kawado, S., Shibata, A., Watanabe, N., and Kikuchi, M., the papers in Energy Beam-Solid Interactions and Transient Thermal Processing, Fan, J. C. C., and Johnson, N. M., eds. (North Holland, NY 1984), p. 491.Google Scholar
7. Knapp, J. A., and Picraux, S. T., to be published.Google Scholar
8. Knapp, J. A., and Picraux, S. T., J. Appl. Phys. 53, 1492 (1982).Google Scholar
9. d'Aragona, F. Secco, J. Electrochem. Soc. 119, 948 (1972).Google Scholar