Hostname: page-component-54dcc4c588-gwv8j Total loading time: 0 Render date: 2025-10-12T21:47:18.436Z Has data issue: false hasContentIssue false
  • English
  • Français

The Role of Nanoparticle Inclusions on High-performance half-Heusler Thermoelectric Materials

Published online by Cambridge University Press:  01 February 2011

Rumana Yaqub ,
Paranti Sahoo Sahoo ,
Julien Pierre Makongo ,
Westly M Notling ,
Pierre F. P. Poudeu  and
Kevin L. Stokes
Rumana Yaqub
Affiliation:
ryaqub@uno.edu, Advanced Material Research Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Paranti Sahoo Sahoo
Affiliation:
pshoo@uno.edu, Advanced Material Research Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Julien Pierre Makongo
Affiliation:
jmkongo@uno.edu, Advanced Material Reserch Institute, Univeristy of New Orleans, New Orleans, Louisiana, United States
Westly M Notling
Affiliation:
kazkek@gmail.com, Advanced Material Research Institute, Univeristy of New Orealns, New Orleans, Louisiana, United States
Pierre F. P. Poudeu
Affiliation:
ppoudeup@uno.edu, University of New Orleans, Chemistry, 2000 Lakeshore Dr, SC2005, New Orleans, Louisiana, 70148, United States, (504)2801057, (504)2803185
Kevin L. Stokes
Affiliation:
klstokes@uno.edu, University of New Orleans, Physics, New Orleans, Louisiana, United States
Get access

Abstract

We report the effect of adding NiO nanoparticles on the transport properties of the half-Heusler alloys Zr0.5Hf0.5Ni1-x PdxSn0.99Sb0.01 (x=0, and 0.2). The half-Heusler matrix materials are prepared by traditional powder metallurgy methods. The resulting bulk matrix is mixed with different volume fractions of nanometer-sized NiO particles, previously synthesized by solution-phase chemical methods. The resulting mixture is densified under uniaxial pressure to form a composite. The resulting material is found to contain both half-Heusler and full-Heusler phases. The corresponding compounds have higher thermal conductivity and electron mobility.

Keywords

thermal conductivityHall effectalloy

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1 Ioffe, A.F., Semiconductor Thermoelements and Thermoelectric Cooling, Inforearch Ltd (1957)Google Scholar
2 Huang, X.Y Solid State Communications, 130, (2004).Google Scholar
3 Chen, L.D, Huang, X.Y Journal of Applied Physics 99, 64305 (2006)Google Scholar
4 Hasselman, D.P.H. and Johnson, L.F., J. Comp.Mater. 21, 508 (1998)Google Scholar
5 Benvensite, Y., J .Appl.Phys. 61 2840 (1987)Google Scholar