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Recent Advances in Thin Film Multilayer Interconnect Technology for IC Packaging

Published online by Cambridge University Press:  21 February 2011

Ronald J. Jensen
Ronald J. Jensen*
Affiliation:
Honeywell Sensors and Signal Processing Laboratory, 10701 Lyndale Avenue South, Bloomington, MN 55420
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Abstract

A high-performance packaging technology being developed at Honeywell and a number of other companies uses thin-film processes to pattern high-density interconnections in multiple layers of a high-conductivity conductor (e.g., copper) and a polymer dielectric, primarily polyimide. This paper describes the physical characteristics and unique advantages of this thin film multilayer (TFML) interconnect technology; it then summarizes the results of recent work done at Honeywell in processing TFML structures, assessing the stability and reliability of the materials system, and fabricating test vehicles and demonstration packages.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 73
Copyright
Copyright © Materials Research Society 1988

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References

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