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Molecular Dynamics Study of Cu Thin Film Deposition onβ-Ta

Published online by Cambridge University Press:  01 February 2011

Peter Klaver  and
Barend J. Thijsse
Barend J. Thijsse
Affiliation:
Delft University of Technology, Department of Materials Science, Rotterdamseweg 137, 2628AL Delft, The Netherlands.
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Abstract

Molecular Dynamics simulations were performed to study Cu film deposition on β-Ta. Three different β-Ta surfaces were used, two being atomically flat, and one resulting from Ta on Ta growth. We find that the Cu films develop a (111) texture with vertical grain boundaries between grains having different epitaxial relations with the β-Ta substrate. The epitaxial rotation angles were determined, as 5.2° and 10-13°, and the resulting strain reductions in the Cu films were identified. The effects of the substrate differences on the interfacial Ta/Cu intermixing and the epitaxy and grain boundary structure of the films are discussed.

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References

1. Klaver, T. P. C. and Thijsse, B. J., Thin Solid Films (2002) (in press).Google Scholar
2. Klaver, T. P. C. and Thijsse, B. J., Mat. Res. Soc. Symp. Proc. 504 (1998) 51.Google Scholar
3. Johnson, R. A. and Oh, D. J., J. Mater. Res. 4 (1989) 1195.Google Scholar
4. Oh, D. J. and Johnson, R. A., “Simple embedded atom method model for fcc and hcp metals,” Atomistic Simulations of Materials: beyond Pair Potentials, ed. Vitec, V. and Srolovitz, D. J., pp. 233–238.Google Scholar
5. Johnson, R. A., Phys. Rev. B 41 (1990) 9717.Google Scholar
6. Boer, F. R. de, Boom, R., Mattens, W. C. M., Miedema, A. R., and Niessen, A. K., Cohesion in metals, ed. Boer, F. R. de and Pettifor, D. (North Holland Physics Publishing 1989) p. 544.Google Scholar
7. Moseley, P.T. and Seabrook, C.J., Acta Cryst. B 29 (1973) 1170.Google Scholar
8. Kwon, K., Ryu, C., Sinclair, R., and Wong, S., Appl. Phys. Lett. 71 (1997) 3069.Google Scholar