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Microstructural Studies of IAD and PVD Cr Coatings by Cross Section Transmission Electron Microscopy

Published online by Cambridge University Press:  28 February 2011

C. C. Cheng ,
R. A. Erck  and
G. R. Fenske
C. C. Cheng
Affiliation:
Materials and Components Technology Division, Argonne National Laboratory, 9700 S. Cass Ave, Argonne, IL 60439
R. A. Erck
Affiliation:
Materials and Components Technology Division, Argonne National Laboratory, 9700 S. Cass Ave, Argonne, IL 60439
G. R. Fenske
Affiliation:
Materials and Components Technology Division, Argonne National Laboratory, 9700 S. Cass Ave, Argonne, IL 60439
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Abstract

Cross section transmission electron microscopy was used to study the microstructure and interface structure of Cr films deposited by ion-assisted deposition as a function of the incident ion energy. High-energy ion bombardment (1 keV) was found to enhance the adhesion of the deposited film owing to the formation of an intermixed layer, whereas deposition with lowenergy ions (100 eV) was found to reduce or eliminate grain boundary porosity. A tailored Cr film with excellent adhesion and no grain boundary porosity was deposited by combining highand low-energy ion bombardment.

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References

1. Netterfield, R. P. and Martin, P. J., Appl. Surf. Sci. 25, 265 (1986).Google Scholar
2. Marinov, M., Thin Solid Films 46, 267 (1977).Google Scholar
3. Baglin, J. E. E., Mater. Sci. Eng. B1, 1 (1988).CrossRefGoogle Scholar
4. Martin, P. J., Netterfield, R. P., and Sainty, W. G., J. Appl. Phys. 55, 235 (1984).CrossRefGoogle Scholar
5. Mullen, K.-H., in Materials Modification and Growth Using Ion Beams, edited by Gibson, U., White, A. E., and Pronko, P. R. (Mater. Res. Soc. Proc. 93, Pittsburge, PA, 1987) pp. 275–285.Google Scholar
6. Huang, C., Lim, G., Parmigiani, E. and Kay, E., J. Vac. Sci. Technol. A1, 2161 (1985).Google Scholar
7. Johansson, B. O., Sundgren, J.-E. and Helmersson, U., J. Appl. Phys. 58, 3112 (1985).CrossRefGoogle Scholar
8. Rossnagel, S. M. and Cuomo, J. J., Vacuum 38, 73 (1988).CrossRefGoogle Scholar
9. Parmigiani, E., Kay, E., Huang, T. C., Perrin, J., Jurich, M., and Swalen, J. D., Phys. Rev. B33, 879 (1986).Google Scholar
10. Erdemir, A. and Cheng, C. C., Ultramicroscopy, accepted for publication, (1989).Google Scholar
11. Movchan, B. A. and Demchishin, A. V., Phys. Metal. Metallogr. 28, 83 (1969).Google Scholar
12. Mattox, D. M., in Deposition Technologies For Films and Coatings, edited by Bunshsh, R. F. et al. (Noyes Publications, Park Ridge, NJ, 1982) p. 66.Google Scholar
13. Martin, P. J., Vacuum 36, 585 (1986).Google Scholar
14. Mattox, D. M., in Adhesion Measurements of Thin Films. Thick Films and Bulk Coatings, ASTM STP 640, edited by Mittal, K. L. (ASTM, Warrendale, PA, 1978) p. 54.Google Scholar