Hostname: page-component-54dcc4c588-m259h Total loading time: 0 Render date: 2025-10-08T23:40:15.763Z Has data issue: false hasContentIssue false

MeV Ion Implantation Doping of Diamond.

Published online by Cambridge University Press:  17 March 2011

S. Prawer
Affiliation:
School of Physics, University of Melbourne, Parkville, Victoria, 3052, Australia
D.N. Jamieson
Affiliation:
School of Physics, University of Melbourne, Parkville, Victoria, 3052, Australia
K.W. Nugent
Affiliation:
School of Physics, University of Melbourne, Parkville, Victoria, 3052, Australia
R. Walker
Affiliation:
School of Physics, University of Melbourne, Parkville, Victoria, 3052, Australia
C. Uzan-Saguy
Affiliation:
Solid State Institute and Physics Department, Technion, Haifa, 32000, Israel
R. Kalish
Affiliation:
Solid State Institute and Physics Department, Technion, Haifa, 32000, Israel
Get access

Abstract

Diamond-based semiconductor devices offer the promise of operation at hightemperatures and under extreme radiation conditions. An essential step inthe drive towards operational diamond-based electronic devices is theability to controllably and reproducibly dope the diamond. Ion implantationis the method of choice for such doping because it offers precise control ofthe dopant concentration and spatially selective doping is achievable usingstandard masking techniques. However, compared to silicon, the doping ofdiamond is complicated by the tendency of the diamond to relax to graphiteupon thermal annealing. Furthermore, even if graphitization can be avoided,the compensation of dopants by residual defects has proved in the past to bea limiting factor in obtaining very high mobility material. In this paper,we present a scheme for the effective doping of diamond using MeVion-implantation. For MeV ion- implantation the doped layer is deeply buriedunder a cap of undamaged diamond, and so the scheme includes a method usingpulsed laser irradiation for making electrical contact to the buried layer.We show that a boron doped layer fabricated by the MeV implantation schemehas, after suitable annealing and removal of these compensating/trappingdefects, very high mobility and low compensation ratio. In fact, itselectrical properties are quite similar to those of natural boron-doped typeIIb diamond.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Kalish, R. and Prawer, S., Ion Implantation of Diamond and Diamond Films, in Handbook of Industrial Diamond and Diamond Films, edited by Prelas, M., Popovici, G., and Bigelow, L.K., Marcel Dekker, New York, (1997).Google Scholar
2. Zeigler, J., Biersack, J.P. and Littmark, U., The Stopping and Range of Ions in Solids, Pergamon, New York, 1985.Google Scholar
3. Prawer, S., Jamieson, D.N., and Kalish, R.: Phys. Rev. Lett. 69, 2991 (1992).Google Scholar
4. Prawer, S. and Kalish, R.: Phys. Rev B51, 15711 (1995).Google Scholar
5. Fontaine, F., Uzan-Saguy, C., Philosoph, B. and Kalish, R.: Appl. Phys. Lett. 68, 2264 (1996).Google Scholar
6. Collins, A. T, in Properties and Growth of Diamond, edited by Davies, G., Inspec, London, (1994), section 9.3, page 273.Google Scholar
7. Braunstein, G., and Kalish, R.: J. Appl. Phys. 54, 2106 (1983).Google Scholar
8. Sze, S.M., Semiconductor Devices: Physics and Technology, John Wiley and Son, New York (1985).Google Scholar
9. Collins, A.T and Lightowlers, E.C.: in The Properties of Diamond, edited by Field, J.E., Academic Press, London, (1979) Chapter 3, page 79.Google Scholar
10. Orwa, J., Jamieson, D.N., Nugent, K.W., and Prawer, S., Phys. Rev B. 62, 54615472 (2000).Google Scholar
11. Kalish, R., Uzan-Saguy, C., Philosoph, B., Richter, V., and Prawer, S.: Applied Physics Letters, 70, 9991001 (1997).Google Scholar
12. Kobayashi, T., Ariko, T., Iwabuchi, M., Maki, T., Shikama, S., Suzuki, S., J. Appl. Phys. 76, 1977 (1994).Google Scholar