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Influence of the structure on the mechanical properties of electrodeposited metallic thin films

Published online by Cambridge University Press:  15 February 2011

J.-L. Delplancke ,
R. Winand ,
J. Dille  and
J. Charlier
J.-L. Delplancke
Affiliation:
Metallurgy - Electrochemistry Department, CP165
R. Winand
Affiliation:
Metallurgy - Electrochemistry Department, CP165
J. Dille
Affiliation:
Physical Metallurgy, CP194/03 Université Libre de Bruxelles, 50 Avenue F.D. Roosevelt, B-1050 Bruxelles, Belgium
J. Charlier
Affiliation:
Physical Metallurgy, CP194/03 Université Libre de Bruxelles, 50 Avenue F.D. Roosevelt, B-1050 Bruxelles, Belgium
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Abstract

Production of thin (10 to 200 microns thick) metallic (Cu, Co and Ni-P) foils is performed by electrodeposition on various substrates. A competition between substrate-induced and electroplating-induced inhibition of crystal growth appears. Film structures observed by SEM, TEM and X-Ray diffraction are related to the mechanical properties of the films (stress-strain curves, microhardness and work hardening bend test).

In some cases, copper thin films with a large number of submicron crystals are obtained. These films recrystallize at room temperature and their mechanical properties are completely modified by this ageing process.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 607
Copyright
Copyright © Materials Research Society 1993

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References

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