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Improving the Understanding of Ion-Beam-Induced Defect Formationand Evolution by Atomistic Computer Simulations

Published online by Cambridge University Press:  17 March 2011

Matthias Posselt*
Affiliation:
Forschungszentrum Rossendorf, Institute of Ion Beam Physics and Materials Research, P.O.Box 510119, D-01314 Dresden, Germany
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Abstract

The morphology of the as-implanted damage in silicon is investigated using arecently developed combination of time-ordered computer simulations based onthe binary collision approximation (BCA) with classical molecular dynamics(MD) calculations. The method is applied to determine the type and theamount of defects formed within the first nanosecond after ion impact. Thedepth profile and the total number of different defect species (vacancies,interstitials, disordered atoms, etc.) produced on average per incident ionare calculated for B+ (15 keV), P+ (5, 10, 20, 30keV), and As+ (15 keV) implantations. It is shown that the as-implanted defect structure depends not only on the nuclear energy depositionper ion but also explicitly on the ion mass. Therefore for each ion speciesthe damage morphology exhibits characteristic features. For heavy ions thepercentage of extended defects is higher than for light ions. In all casesinvestigated the number of free or isolated interstitials exceeds the amountof free vacancies. The results obtained allow a microscopic interpretationof the phenomenological model for the as-implanted damage employed inconventional BCA simulations in order to describe the dose dependence of theshape of ion range profiles. They can be also applied to get more realisticinitial conditions for the simulation of the defect kinetics duringpost-implantation annealing.

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Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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