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Hall-Petch Hardening in Pulsed Laser Deposited Nickel and Copper Thin Films

Published online by Cambridge University Press:  10 February 2011

J. A. Knapp ,
D. M. Follstaedt ,
J. C. Banks  and
S. M. Myers
J. A. Knapp
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-1056
D. M. Follstaedt
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-1056
J. C. Banks
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-1056
S. M. Myers
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-1056
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Abstract

Very fine-grained Ni and Cu films were formed using pulsed laser deposition onto fused silica substrates. The grain sizes in the films were characterized by electron microscopy, and the mechanical properties were determined by ultra-low load indentation, with finite-element modeling used to evaluate the properties of the layers separately from those of the substrate. Some Ni films were also examined after annealing to 350 and 450°C to enlarge the grain sizes. These preliminary results show that the observed hardnesses are consistent with a simple extension of the Hall-Petch relationship to grain sizes as small as 11 nm for Ni and 32 nm for Cu.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 69
Copyright
Copyright © Materials Research Society 2000

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References

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