Published online by Cambridge University Press: 17 March 2011
Erbium atoms were implanted into p-type Si (111) wafers at an extractionvoltage of 60 kV to doses ranging from 5×1016 to 2×1017 cm−2 using a metal vapour vacuum arc (MEVVA)ion source. The implantation was performed with beam current densities from3 to 26 µA/cm2 corresponding to substrate temperatures rangingfrom 85 to 245°C. The characterization of the as-implanted and annealedsamples was performed using Rutherford backscattering spectrometry, atomicforce microscopy and x-ray diffraction. To determine the sputtering yield,masked implantation experiments were performed so that the thickness of thesputtered layer at different substrate temperatures can be obtained directlyby an α-step surface profiler. The results showed that ErSi2-xwasdirectly formed by MEVVA implantation when the substrate temperature washigher than about 160°C. The effects of the implant dose and the beamcurrent density on the retained dose, the sputtering yield and the surfacemorphology of the implanted samples were also studied.