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Fabrication of Amorphous Silicon Devices on Plastic Substrates

Published online by Cambridge University Press:  28 February 2011

F. R. Jeffrey ,
G. D. Vernstrom ,
F. E. Aspen  and
R. L. Jacobson
F. R. Jeffrey
Affiliation:
3M Electrical and Communications Technologies Laboratory 3M Center, St. Paul, Minnesota 55144
G. D. Vernstrom
Affiliation:
3M Electrical and Communications Technologies Laboratory 3M Center, St. Paul, Minnesota 55144
F. E. Aspen
Affiliation:
3M Electrical and Communications Technologies Laboratory 3M Center, St. Paul, Minnesota 55144
R. L. Jacobson
Affiliation:
3M Electrical and Communications Technologies Laboratory 3M Center, St. Paul, Minnesota 55144
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Abstract

As Amorphous silicon devices spread into more products, the advantages inherant in continuous processing utilizing a plastic roll substrate will assume greater importance. Advantages include cost, ease of handling, shipping weight, steady state processing conditions and feedback control available in continuous processing. A new set of problems and constraints also comes with plastic substrates. These problems include mechanical strength with flexing, substrate surface defects, differential expalsion coefficients, shrinkage, and contaminant control. These problems along with efforts to evaluate and overcome them are discussed.

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