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Effects of Softbake Parameters on a Benzocyclobutene (BCB) Adhesive Wafer Bond

Published online by Cambridge University Press:  01 February 2011

Daniel N. Pascual
Daniel N. Pascual*
Affiliation:
North America Applications Center SUSS MicroTec 228 Suss Drive Waterbury Center, VT 05677, U.S.A.
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Abstract

This study explores the effects of softbake parameters including temperature and duration on the homogeneity and toughness of a Benzocyclobutene (BCB) adhesive bond. Experiments were initially performed on silicon wafer pieces and then verified using quartered wafers bonded on a different machine. A four-point bend delamination test was employed to quantitatively measure interface toughness while uniformity was analyzed visually. A softbake temperature of 150 °C for 10 minutes yielded strong void-free bonds with an interface toughness of 23 J/m2.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A5.20
Copyright
Copyright © Materials Research Society 2004

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References

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