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Direct Writing of Copper Lines From Copper Formate Film

Published online by Cambridge University Press:  26 February 2011

Arunava Gupta  and
Rangarajan Jagannathan
Arunava Gupta
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Rangarajan Jagannathan
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

The focused output from an argon ion laser (514 nm) has been used for direct writing of copper by photothermal decomposition of copper formate film on quartz and silicon substrates. The low decomposition temperature of the metallo-organic (∼200°C) allows deposition of fairlys thick copper lines at writing speeds as high as 10 mm/sec. The processing can be done in air since the rapid decomposition and cooling under scanning condition results in minimal oxidation of the deposited copper. The temperature distribution produced during laser writing on silicon substrate has been calculated to help explain some of the observed results.

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References

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