Hostname: page-component-54dcc4c588-dbm8p Total loading time: 0 Render date: 2025-10-10T18:36:37.995Z Has data issue: false hasContentIssue false
  • English
  • Français

Delamination Trends of Underfill in Dca Assemblies

Published online by Cambridge University Press:  10 February 2011

Y. Sha ,
C.Y. Hui ,
E. J. Kramer ,
P. Borgesen  and
G. Westby
Y. Sha
Affiliation:
Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853
C.Y. Hui
Affiliation:
Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853
E. J. Kramer
Affiliation:
Materials Science and Engineering, Cornell University, Ithaca, NY 14853
P. Borgesen
Affiliation:
Surface Mount Technology Lab.Universal Instruments Corp., Binghamton, NY 13902
G. Westby
Affiliation:
Surface Mount Technology Lab.Universal Instruments Corp., Binghamton, NY 13902
Get access

Abstract

Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 3
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1 Hein, V. and Erdogan, F., Intl. J. of Fracture Mechanics, Vol. 17, No. 3, 1971, pp. 317–330 Google Scholar
2 Bogy, D. B., Transactions of ASME, J. of Applied Mechanics. 1968, pp. 460–466 Google Scholar
3 Abaqus User's Manual, Version 5.3, Hibbitt, Karlsson & Sorensen, Inc. 1993 Google Scholar