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Deformation Behavior of Leadless 60% Pb–40% Sn Solder Joints

Published online by Cambridge University Press:  21 February 2011

Ravichandran Subrahmanyan ,
Donald Stone  and
Che-Yu Li
Ravichandran Subrahmanyan
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
Donald Stone
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

Room temperature deformation data of leadless solder joints are reported. The joints were sheared under cyclic, displacement controlled loading at frequencies between 0.001 and 0.01 Hz. A microplastic model was utilized to simulate the stress-strain loops, which demonstrated a pronounced Bauschinger effect. The implications of microplasticity on fatigue life of solder joints are discussed. This phenomenon must be taken into account in an accurate prediction of solder deformation at low strain ranges.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 381
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1.Stone, D., Hannula, S.-P., and Li, C.-Y., Proc. 35th Electronics Components Conference, IEEE, New York NY, 1985, pp.46–51.Google Scholar
2.Jackson, M. S., Cho, C. W., Alexopoulos, P., and Li, Che-Yu, J.Eng. Mat. Tech., 103, 314 (1981)Google Scholar
3.McClintock, F.A. and Argon, A.S., Mechanical Behavior of Materiala, (Addison-Wesley, Reading MA., 1968), pp. 184–186.Google Scholar
4.Stone, D., Wilson, H., Subrahmanyan, R., and Li, C.-Y., Proc. National Electronic Packaging Conference East, June, 1986 pp. 175–180.Google Scholar
5.Sowerby, R. and Uko, D.K., Mat. Sci. Engr. 41, 43 (1979).Google Scholar
6.Mughrabi, H., in Constitutive Equations in Plasticity, edited by Argon, A. S. (MIT Press, Cambridge, Mass., 1975) p. 199Google Scholar
7.Sherry, W. M. and Hall, P. M., Proc. 3rd International Conference in Interconnection Technology in Electronics, Fellbach, Germany, W., Feb. 18–20, 1986, pp 47–81Google Scholar
8.Clech, J.-P. and Augis, J.A., in Proceedings, 7th Annual International Electronics Packaging Society Conference, Boston MA, 1987.Google Scholar