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Compact Modelling of Electrical, Mechanical and Thermal Behaviour for MEMS with SPICE

Published online by Cambridge University Press:  01 February 2011

Andreas Frank ,
J.-P. Zoellner ,
Y. Sarov ,
Tz. Ivanov ,
I. Kuhnholz ,
St. Klett ,
I. W. Rangelow ,
M. Swiatkowski ,
T. Gotszalk  and
N. Nikolov
Andreas Frank
Affiliation:
andreas.frank@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany, +49(0)367769-1590, +49(0)367769-3132
J.-P. Zoellner
Affiliation:
jens-peter.zoellner@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
Y. Sarov
Affiliation:
yanko.sarov@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
Tz. Ivanov
Affiliation:
tzvetan.ivanov@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
I. Kuhnholz
Affiliation:
ingo.kuhnholz@stud.tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
St. Klett
Affiliation:
stefan.klett@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
I. W. Rangelow
Affiliation:
ivo.rangelow@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
M. Swiatkowski
Affiliation:
teodor.gotszalk@pwr.wroc.pl, Wroclaw Technical University, Wroclaw, 50372, Poland
T. Gotszalk
Affiliation:
teodor.gotszalk@pwr.wroc.pl, Wroclaw Technical University, Wroclaw, 50372, Poland
N. Nikolov
Affiliation:
nn6210@abv.bg, Microsystems Ltd., Varna, 9010 P.O. Box 147, Bulgaria
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Abstract

In this paper we present a novel method of nonlinear macro model of a cantilever for mixed domain simulation only with SPICE. Based on lumped elements of equivalent circuits a model is developed, which realizes a coupled electro-thermal-mechanical simulation including crosstalk effects. The model is verified with measurement and helps to class and solve crosstalk. With SPICE as electrical circuit simulator the cantilever array could be simulate in conjunction with the excitations and analysis electronics more detailed like the system level models and faster like FEM-simulation.

Keywords

microelectro-mechanical (MEMS)simulationmicroelectronics

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References

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