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Advanced Thermal Interface Materials

Published online by Cambridge University Press:  26 February 2011

Yimin Zhang ,
Allison Xiao  and
Jeff McVey
Yimin Zhang
Affiliation:
yimin.zhang@nstarch.com, National Starch and Chemical Company, Corporate Research Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States, 908-685-5697, 908-685-7400
Allison Xiao
Affiliation:
allison.xiao@nstarch.com, National Starch and Chemical Company, Corporate Technology Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States
Jeff McVey
Affiliation:
jeff.mcvey@nstarch.com, National Starch and Chemical Company, Corporate Technology Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States
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Abstract

Thermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs. This paper discusses the current state-of-art TIM solutions, particularly fusible particles for improved thermal conductivity. The paper will address the benefits and limitations of this approach, and describe a system with unique filler morphology. Thermal resistance and diffusivity/conductivity characterization techniques are also discussed.

Keywords

thermal conductivitysinteringalloy

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V05-10
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Chan, A., US Patent Application 20050056365 (2005)Google Scholar
2. Capote, M.A., World Patent PCT WO090942. (2004)Google Scholar
3. Gallager, C., Matijasevic, G., and Capote, A., US Patent 5853622 (1998)Google Scholar
4. Lutz, B., Gandhi, P, Shearer, B., US Patent 5922397 (1999)Google Scholar
5. Hill, R. F. and Hampton, F. H., US Patent 6791928 (2004)Google Scholar
6. Bhagwagar, D. E., US Patent 6791839 (2004)Google Scholar
7. Balian, C., Bergerson, S., and Currier, G. C., US Patent Application 0227959 (2003)Google Scholar
8. Tetsuka, H., Mita, K., Yamada, K., Aoki, Y., and Yoneyama, T., US Patent 6940722 (2005)Google Scholar
9. Bunyan, M., US Patent 6946190 (2005)Google Scholar
10. Jayaraman, S., Koning, P., Dani, A., US Patent 6926955 (2005)Google Scholar
11. Zhao, M., Zhou, X.H., Jiang, Q., Q. J. Mater. Res. 16, 3304 (2001).10.1557/JMR.2001.0454Google Scholar
12. Buffat, Ph. and Borel, J-P., Physical Rev. A. 13, 2287 (1976)Google Scholar
13. Berry, R.S., Jellinek, J., and Natanson, G., Physical Rev. A. 30, 919 (1984)Google Scholar
14. ASTM-D5470 Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials (2006)Google Scholar