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Young's Modulus and Fracture Strength of Three Polysilicons

Published online by Cambridge University Press:  17 March 2011

W. N. Sharpe Jr. ,
K. Jackson ,
G. Coles  and
D. A. LaVan
W. N. Sharpe Jr.
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
K. Jackson
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
G. Coles
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
D. A. LaVan
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
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Abstract

Polysilicon specimens from Cronos, Sandia, and Standard MEMS, Inc. were tested in tension. The specimens were nominally 6 or 20 μm wide and 250 or 1000 μm long. The Cronos and the Standard MEMS specimens had thicknesses of 1.5, 2.0, and 3.5 μm; whereas, the Sandia specimens were all 2.5 μm thick.

There was no dramatic difference in Young's modulus for the three materials. A total of 117 tests were run, and the average modulus for all three materials was 157 ± 9 GPa. However, the strengths were quite different: 1.56 ± 0.25 GPa for the Cronos material, 2.85 ± 0.40 GPa for Sandia's, and 2.04 ± 0.30 GPa for the SMI polysilicon.

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References

REFERENCES

1. Sharpe, W. N. Jr., Jackson, K., Coles, G. in MEMS-Vol. 2, Micro-Electro-Mechanical Systems (MEMS), ASME, Orlando, FL, 2000 pp. 255–259.Google Scholar
2. Koskinen, J., Steinwall, J. E., Soave, R., Johnson, H. H., Journal of Micromechanics and Microengineering, 35, pp. 13–17 (1993).Google Scholar
3. Biebl, M. and Philipsborn, H. V. in Transducers '95 - Eurosensors IX Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, Stockholm, Sweden, (1995) pp. 72–75.Google Scholar
4. Biebl, M., Brandl, G., Howe, R. T., in Transducers '95 - Eurosensors IX Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, Stockholm, Sweden, (1995) pp. 80–83.Google Scholar
5. Tsuchiya, T., Sakata, J., Taga, Y., Thin-Films; Stresses and Mechanical Properties VII, (Materials Research Society Symposium 505, Boston, MA, 1998) pp. 285–290.Google Scholar
6. Sharpe, W.N. Jr., Turner, K. T., Edwards, R. L., Experimental Mechanics, 39, pp.162–170, (1999).Google Scholar
7. Sharpe, W.N. Jr., Jackson, K., Hemker, K. J., Zie, Z., Journal of Microelectromechanical Systems, accepted for publication (2001).Google Scholar
8. Sharpe, W.N. Jr., and Jackson, K., Mechanics and Measurements Symposium 2000, Society for Experimental Mechanics, Orlando, FL, (2000) pp. ix–xiv.Google Scholar
9. Tsuchiya, T., Tabata, O., Sakata, J., Taga, Y., Journal of Microelectromechanical Systems, 7, pp. 106–113 (1998).Google Scholar
10. LaVan, D.A., Tsuchiya, T., Coles, G., Mechanical Properties of Structural Films, ASTM STP 1413, American Society for Testing and Materials, accepted for publication (2001).Google Scholar
11. Dowling, N. E., Mechanical Behavior of Materials, Prentice Hall, 1999, p. 803.Google Scholar