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Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions

Published online by Cambridge University Press:  21 March 2011

Anis Zribi ,
Peter Borgesen ,
Lubov Zavalij  and
Eric J. Cotts
Anis Zribi
Affiliation:
Physics Department, Binghamton University P.O. Box 6016; Binghamton, NY 13902
Peter Borgesen
Affiliation:
Universal Instruments Corp Binghamton, NY 13905
Lubov Zavalij
Affiliation:
Physics Department, Binghamton University P.O. Box 6016; Binghamton, NY 13902
Eric J. Cotts
Affiliation:
Physics Department, Binghamton University P.O. Box 6016; Binghamton, NY 13902
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Abstract

Diffusion and phase formation were monitored in solder joints consisting of flip chips with Ni(V) under-bump metallizations bumped with Ag3.8Cu1.85Sn94.35 (atomic percentage) solder reflowed on printed circuit boards with Cu/Ni/Au metallizations. A ternary alloy, (CuNi)6Sn5, was observed to form during reflow at solder/Ni interfaces in these Ag3.8Cu1.85Sn94.35/Au/Ni solder joints. After extended thermal aging at 150 oC, a second ternary compound, (CuNi)3Sn4 forms at the Ni/(CuNi)6Sn5 interface. The growth of these alloys depletes the solder of essentially all Cu, changing its mechanical properties and melting temperature.

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