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Effects of hydrothermal aging on the dielectric properties of epoxy molding compounds

Published online by Cambridge University Press:  21 March 2011

Patrice Gonon ,
Alain Sylvestre ,
Jérôme Teysseyre  and
Christophe Prior
Patrice Gonon
Affiliation:
Lab. for Electrostatics and Dielectric Materials., University of Grenoble and French, National Center for Scientific Research. LEMD-CNRS, BP 166, 38042 Grenoble Cedex 9, France. (E-mail: gonon@polycnrs-gre.fr)
Alain Sylvestre
Affiliation:
Lab. for Electrostatics and Dielectric Materials., University of Grenoble and French, National Center for Scientific Research. LEMD-CNRS, BP 166, 38042 Grenoble Cedex 9, France. (E-mail: gonon@polycnrs-gre.fr)
Jérôme Teysseyre
Affiliation:
Corporate Package Development, ST Microelectronics. BP 217, 38019 Grenoble Cedex, France
Christophe Prior
Affiliation:
Corporate Package Development, ST Microelectronics. BP 217, 38019 Grenoble Cedex, France
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Abstract

We studied the influence of hydrothermal aging on the dielectric properties of epoxy molding compounds used for integrated circuits packaging. Samples were subjected to two different aging (JEDEC 1 and JEDEC 3 procedures, followed by a thermal stress at 240°C for a few minutes). Resistance to aging was studied as a function of crosslinking density. Water uptake increases with crosslinking. Aging leads to a reduction in the dielectric constant and to an increase in the loss factor. Post-mold curing is found to slightly enhance the resistance against hydrothermal aging.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N1.5
Copyright
Copyright © Materials Research Society 2001

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References

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